| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| LT3045EDD#TRPBF | IC |
ADI/亚德诺 |
DFN10 |
22+ |
2500 |
|||
| SN65C1168ERGYR | 运放IC |
TI/德州仪器 |
QFN16 |
20+ |
6000 |
|||
| LM25010MHX/NOPB | IC |
TI/德州仪器 |
TSSOP-14 |
21+ |
8000 |
|||
| IRM-H638T/TR2(DX) | 存储器 |
EVERLIGHT/亿光 |
SMD |
21+ |
12000 |
|||
| LM1117MPX-5.0 | IC |
TI/德州仪器 |
SOT-223 |
20+ |
10000 |
|||
| MAX98357AETE+T | 存储IC |
MAXIM/美信 |
TQFN16 |
23+ |
5000 |
|||
| MIC4420YM-TR | IC |
MICROCHIP/微芯 |
SOP-8 |
22+ |
20000 |
|||
| LM3404HVMAX/NOPB | 逻辑IC |
TI/德州仪器 |
SOP-8 |
23+ |
7500 |
|||
| FF600R12ME4 | IGBT模块 |
INFINEON/英飞凌 |
IGBT |
22+ |
100 |
|||
| FF450R12ME4 | MOSFET或IGBT开关IC |
INFINEON/英飞凌 |
IGBT |
21+ |
200 |
|||
| 0102735J98 | BROADCOM/博通 |
SMD |
D/C20121106 |
875 |
||||
| BCM2070B0KUBG | BROADCOM/博通 |
BGA |
D/CCD0930P20 |
4970 |
||||
| M32L32321SA-7Q | RENESAS/瑞萨 |
TSSOP |
0512 |
1000 |
||||
| IP4264CZ8-20 | NXP/恩智浦 |
SMD |
D/C11411149 |
32000 |
||||
| MAX9117EXK | 模拟IC |
MAXIM/美信 |
SOT23-6 |
1227+ |
952 |
|||
| CL02A471KP2NNNC | 贴片电容 |
SAMSUNG/三星 |
SMD |
1518+ |
300000 |
|||
| CL02A473KQ2NNNC | 贴片电容 |
SAMSUNG/三星 |
SMD |
1518+ |
300000 |
|||
| CL02B221KP2NNNE | 贴片电容 |
SAMSUNG/三星 |
SMD |
1518+ |
300000 |
|||
| CL02B151KP2NNNC | 贴片电容 |
SAMSUNG/三星 |
SMD |
1518+ |
300000 |
|||
| CL02B221KP2NNNC | 贴片电容 |
SAMSUNG/三星 |
SMD |
1518+ |
300000 |
商家默认展示20条库存